Chemical-mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses (Hb): Fundamental Mechanisms and Application to IC Interconnect Technology

ISBN-10: 1402071930
ISBN-13: 978-1402071935
Edition: 2002nd
Publisher: SPRINGER

Name: Chemical-mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses (Hb): Fundamental Mechanisms and Application to IC Interconnect Technology
SKU: 9781402071935
Availability: InStock

SKU: 9781402071935

Original price was: ₹17,168.99.Current price is: ₹11,159.84.

Explore the cutting-edge field of chemical-mechanical polishing (CMP) with “Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses” by Springer. This essential hardcover resource, ideal for IC interconnect technology professionals and researchers, delves into the fundamental mechanisms behind CMP for low-k materials. Discover how these advanced techniques are revolutionizing semiconductor manufacturing. If you’re seeking in-depth knowledge on creating superior microelectronic devices, this book offers crucial insights. Enhance your understanding of dielectric materials and polishing processes to optimize yields and performance in the rapidly evolving semiconductor industry. A must-have for any specialist in the field, available at The Bookish Owl.

5 in stock

Category: Higher Education Textbooks Tag: Borst C.l.